Emage Group designs and develops inspection solutions for the semiconductor industry, combining the Group’s machine vision and automation competency. Our State-of-the-Art AOI Post Wire Inspection Handling System is equipped with the latest imaging technology and provides high speed 2D+3D inspections and an optional High Resolution Bond inspection station with a host of other innovations to address today’s specific semiconductor packaging needs.
Designed for High Speed Imaging, providing On-The-Fly & Image Stitching technology with speed in excess of 80mm/s, up to 500k uph and/or with up to a million of 2D/3D measurements per hour, at micron level accuracy and repeatability. Our state-of-art inspection technology aims to enhance production yields with dedicated solutions to suit the market requirements.
